Dr. Ghassan Kridli

VISITING ASSOCIATE PROFESSOR  

Office Number: 241 E
Office Phone: +974 423-0233
Fax Number: 4230066
Email     Homepage

PROFESSIONAL INTERESTS
Dr. Kridli's general interest area is product design and manufacturing. His specific experience is in elevated temperature processing of aluminum alloys; such as warm forming and superplastic forming. He also has an interest in engineering education.

EDUCATION

• Doctor of Philosophy, Mechanical Engineering, University of Missouri-Columbia, 1997
• Master of Science, Mechanical Engineering, University of Miami, 1988
• Bachelor of Science, Mechanical Engineering, University of Miami, 1986

EXPERIENCE

• Visiting Associate Professor, 08/2009- Present, Department of Mechanical Engineering Texas A&M University at Qatar (on leave from UM-Dearborn).
• Associate Professor, 09/2003 - 07/2009, Department of Industrial and Manufacturing Systems Engineering, Acting Director of Interdisciplinary Programs 9/2003 - 12/2003, University of Michigan-Dearborn.
• Faculty Intern, 5/2007 - 10/2007, and 5/2008 - 8/2008, Chrysler, LLC. Michigan.
• Assistant Professor, 8/1997 - 8/2003, Department of Industrial and Manufacturing Systems Engineering, University of Michigan-Dearborn.
• Research and Teaching Assistant, 8/1992 - 12/1996, Instructor 1/1997 - 5/1997, Mechanical and Aerospace Engineering, University of Missouri-Columbia.
• Maintenance Engineer, 9/1990 - 1/1992, Kridli Poultry Farms, Jordan
• Mechanical Engineering Instructor, 9/1988 - 9/1990, Military Technical College, Jordan.
  

RECENT PUBLICATIONS AND CONFERENCE PRESENTATIONS
Le, Q., Kang, H.T., Kridli, G., Khosrovaneh, A.K., and Benda, Y., Effect of Pre-strain Paths on Mechanical Behavior of Dual Phase Sheet Steel, International Journal of Fatigue, Accepted for Publication, Vol 31, No. 4, pp. 607-615, 2009.

Le, Q., Kang, H.T., Kridli, G., Khosrovaneh, A.K., and Benda, Y., Modified Strain-Life Equation to Consider the Effect of Different Pre-strain Paths for Dual Phase Sheet Steel, Journal of Materials Processing Technology, Vol. 209, No. 7, pp. 3525-3531, 2009.